High Density Metal Free

High Density Metal Free

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This resin provides a high amount of activation for metal attachment allowing for higher binding capacity. The resin is adequate to work in batch or column purifications (Low Flow). It is supplied without any metal and it is necessary to charge the resin using the selected divalent cation following instructions.

Product Name High Density Metal Free
Cat. No. 6BCL-QH-X
Bead Geometry & Size Spherical,Standard:~ 50-150 µm
Crosslinked Yes
Agarose % 6%
Matrix Stable in all commonly used reagents
Binding/Loading Capacity (μmol Me2+/ml gel) 20-40
Antimicrobial Agent 20% Ethanol
Storage Temperature 2-8˚C
Technical Specifications View
Procedure of Use View